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The opinions, findings, and conclusions or recommendations expressed are those of the Center author(s) and do not necessarily reflect the views of the National Science Foundation.

Center Overview

The mission of the Center for High-Frequency Electronics and Circuits for Communication Systems (CHECCS) is to develop innovative and multidisciplinary solutions to address technical challenges in the increasingly complex area of advanced electronics and circuits for communications systems. CHECCS develops different levels of integrated components, subsystems, and multiscale systems for current and future high-frequency communication systems. CHECCS strives to accelerate technology transfer of research into commercially viable products, stimulate spinoffs and startup companies, and enable the growth of local industries.

High-frequency communication systems have penetrated almost all aspects of our daily life, with applications including autonomous cars, personalized medicine, monitored health care, agricultural sensing, and merchandise inventory systems. The scope of CHECCS’ work includes materials, electronics, devices, circuits, radiation, and their applications.

CHECCS conducts research in radio frequency (RF) communication devices, circuits, and systems. Its work in advanced telecommunications includes 5G and future systems, sensors, drones, high-resolution imaging, and up to terahertz (THz) frequency technology. The RF/microwave/mm-wave industry encompasses a wide range of companies and government facilities engaged in the synthesis, processing, and applications of electronic devices and circuits. Applications include defense systems, personalized medicine and monitored health care, agricultural sensing, and merchandise inventory.

CHECCS aims to satisfy the national need for qualified U.S. engineers and scientists who have deep knowledge of various technically challenging areas supporting high-frequency communications. The center educates students in these advanced topics and equips them with skills that are in high demand to prepare them for careers serving the commercial or defense sectors, national research labs, or academia.

Universities

  • Florida International University
  • University of Tennessee, Knoxville
  • University of Arkansas, Fayetteville
View Center Website

Center Personnel

Aly E Fathy
UTK Site Director
(865) 974-3466
fathy@eecs.utk.edu

John L Volakis
FIU Site Director
(305) 348-1197
jvolakis@fiu.edu

Samir El-Ghazaly
CHECCS Director and UARK site director
(479) 575-6048
el-ghazaly@uark.edu

Research Focus

CHECCS helps industry and government members address challenging multidisciplinary research problems in high-frequency communication systems. Center interests are mapped into four areas.

Novel 2D Materials for High-Frequency Communication Devices and Systems

Growth and characterization of quantum 2D materials; fabrication of nano/microfabricated optical and electronic devices, lasers, detectors, and sensors with integrated electronics; physics-based modeling and SPICE modeling of devices; noise theory for electronic systems; analog-based encryption for secure data transmission.

Integrated Microwave Photonics: From Materials and Devices to Fully Integrated Chips

Electrical and photonic materials; passive millimeter-wave cameras, RF-optical modulators, dissimilar material integration; optoelectronics for future integrated photonics; novel optoelectronic devices; high-temperature optoelectronics and its applications.

Global Modeling and Computational Electromagnetics

Advanced simulations of mm-wave devices; high-speed board processing and intelligent systems; performance scaling for electromagnetic (EM) application; large-scale computational EM problems; computational EMAG development.

Next-Generation Antennas and High-Data Rate Processing

Novel antennas; ultra-wideband reconfigurable antenna arrays from UHF up to sub-THz bands; reconfigurable transceiver front-ends; low-power beam forming architectures; radio frequency interference (RFI) mitigation techniques; beam-forming networks; high-power combining; UWB precise localization, see-through wall imaging; radars; high-resolution imaging; wearable electronics and non-contact vital sign detection; human gait analysis; massively distributed antenna systems; large-scale data analytics with real-time signal processing; taming and leveraging challenges in millimeter-wave; RF circuits.

Awards